Fully automated 3D solder paste inspection, bench-top, low cost system for SMT process. Fully programmable and automatic. The whole board inspection takes only minutes and results are presented with SPC.
- Fully Automated 3D solder paste inspection
- 3D scan measure height, area and volume
- 3D simulation & recombination view
- Programmable multi-area 3D scan measurement
- Auto focus check to offset PCB warping
- Programmable, automatic & repeatable
- Large board size with adjustable board holder
- Full SPC functions
- Product and production line details entry
3D viewing of scanned solder paste is created for better visualization of screen printing in a three dimensional viewing model. Click and drag to view from any angles, any orientation. Color contrast highlights 3D morphology of solder paste printing.
Actual demonstration of 3D solder paste inspection