CX3000 Series (50-300x, 3D Rotation, Wire Bond Inspection)

CX-3000 3D 360-Degree Rotational Microscope 50x-300x is for Semiconductor’s Wire Bond Inspection and Measurement

Showing the single result

  • CX-3000


    3D Microscope with Motorized Rotation

    Designed for Wire Bonding and Ultra-Fine Pitch SMT Inspection

    • 50x – 300x Zoom Magnification
    • 45 Degree Oblique Angle Viewing
    • 0 Degree Straight Viewing
    • Motorized Rotation
    • 6 MP SONY CMOS Camera Sensor for High-Resolution Image
    • HDMI and USB Outputs
    • SD Card for Capturing Photo and Video
    • Measurement Functions

    Please select LCD and Stand Options, and Add to Cart

    Select optionsLoading Done This product has multiple variants. The options may be chosen on the product page