Video Measurement System

SPI-200-3D

$8,800.00

Low-Cost, User-Friendly, Fast 3D SPI System

  • Low-Cost, Off-Line, 3D SPI system supports multiple SMT lines for inspecting solder paste printing
  • Improve your product yield and meet your customer’s requirements with an affordable budget
  • Same measuring technique as high-end automated in-line SPI system
  • Measure solder paste height with a laser beam
  • User Friendly, Fast, Simple Mouse Clicks
  • 3D real-time view of solder paste
  • Zoom 15x – 200x
  • Can Also Measure Typical Dimensions like Linear, XY, Radius, Diameter, Angle, Area, etc.
  • Multiple Applications: BGA, SMT, Solder Inspection and Measurement
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Description

3D Solder Paste Inspection Measurement System

LOW-COST 3D SPI System

  • Low-Cost, Off-Line, 3D SPI system supports multiple SMT lines for inspecting solder paste printing
  • Improve your product yield and meet your customer’s requirements with an affordable budget
  • Same measuring technique as high-end automated in-line SPI system
  • Measure solder paste height with a laser beam
  • 3D real-time view of solder paste
  • Zoom 15x – 200x
  • Can Also Measure Typical Dimensions like Linear, XY, Radius, Diameter, Angle, Area, etc.
  • Multiple Applications
  • You can inspect and measure BGA solder joints and fine-pitch SMT with this SPI-200-3D system

 

Laser Light Triangulation Method

To Measure Solder Paste Height and Any Height or Depth Measurements

 

Fast, Easy, No Programming

  • Easy to use, NO training required, Ready to Implement
  • Simple mouse clicks to get results FAST
  • A economic, off-line, bench-yop unit supports multiple SMT lines
  • Save measurements with image, and export measurement results to Excel
  • Perform measurements with a mouse and show results directly on LCD, without a computer.
  • Or, connect to a Windows computer and perform measurements on a PC.

 

3D rotational viewing lens included for

  • Solder Inspection
  • 3D BGA Inspection
  • Soldering Rework

 

Specifications

SPI-200-3D Specifications 
Camera Auto Focus 6MP CMOS HD and USB dual outputs digital microscope camera
Illumination High-intensity white LED ring light with intensity adjustment
Measurement mode Multiple or single points height measuring within the Field Of View
Measuring Laser Precise red laser line with intensity adjustment for paste height profiling
Z height resolution 1 micron
Repeatability ± 2 microns
Measurement Software
  • Measure solder paste height with laser line offset.
  • Measurement function: XY, radius, diameter, angle, area, width, and path length. 
  • Multiple calibrations, annotation, crosshairs, reticles, and comparison.
  • Image Stacking for Infinite Depth of Focus
  • Photo sticking for extender field of view at high resolution.
  • Measurement data output to Excel. Save image as jpg with measurement results.
Measurement
Accuracy (XY)		 5μ at 30x
1μ at 200x
3D inspection mode 3D 360° manual rotation with 35° oblique angle viewing and 0° straight down view
Zoom Lens
  • 30x-200x zoom with detents
  • Expandable with optional lens adapters: 0.3x, 0.5x, 0.7x, 1.5x, 2x.
Field of View 1.2mm (at 200x) to 8mm (at 30x)
Viewing angle 0° straight view and 30° angle view with standard system
Working Distance 100mm (4″) WD with a straight view
50mm (2″) WD with 30° angle view adapter
System Stand Multi-position arm boom stand with focus control block and weight base
Power Supply 120-240V AC 50/60Hz
Computer Requirements Windows 10/8/7 with USB2.0 port
Warranty One Year Warranty

Options
LCD-12
  • 12″ UltraSharp Retina Display 1920x1080p real-time 60 FPS viewing, HDMI Input
  • Mounted on HD-60 camera for direct line of sight ergonomic inspection
LCD-24 24” Desktop 1920x1080p real-time 60 FPS viewing, HDMI Input
BGA-HM BGA inspection mirror to work with SPI-200 for inspecting BGA solder joints
XY1711 17″ x 11″ XY sliding stage for Multi-position boom stand

 

Options