Description

3D Solder Paste Inspection Measurement System

LOW-COST 3D SPI System

• Low-Cost, Off-Line, 3D SPI system supports multiple SMT lines for inspecting solder paste printing
• Improve your product yield and meet your customer’s requirements with an affordable budget
• Same measuring technique as high-end automated in-line SPI system
• Measure solder paste height with a laser beam
• 3D real-time view of solder paste
• Zoom 15x – 200x
• Can Also Measure Typical Dimensions like Linear, XY, Radius, Diameter, Angle, Area, etc.
• Multiple Applications
• You can inspect and measure BGA solder joints and fine-pitch SMT with this SPI-200-3D system

 

Laser Light Triangulation Method

To Measure Solder Paste Height and Any Height or Depth Measurements

 

Fast, Easy, No Programming

• Easy to use, NO training required, Ready to Implement
• Simple mouse clicks to get results FAST
• A economic, off-line, bench-yop unit supports multiple SMT lines
• Save measurements with image, and export measurement results to Excel
• Perform measurements with a mouse and show results directly on LCD, without a computer.
• Or, connect to a Windows computer and perform measurements on a PC.

 

3D rotational viewing lens included for

• Solder Inspection
• 3D BGA Inspection
• Soldering Rework

 

Specifications

SPI-200-3D Specifications
Camera	Auto Focus 6MP CMOS HD and USB dual outputs digital microscope camera
Illumination	High-intensity white LED ring light with intensity adjustment
Measurement mode	Multiple or single points height measuring within the Field Of View
Measuring Laser	Precise red laser line with intensity adjustment for paste height profiling
Z height resolution	1 micron
Repeatability	± 2 microns
Measurement Software	Measure solder paste height with laser line offset. Measurement function: XY, radius, diameter, angle, area, width, and path length.  Multiple calibrations, annotation, crosshairs, reticles, and comparison. Image Stacking for Infinite Depth of Focus Photo sticking for extender field of view at high resolution. Measurement data output to Excel. Save image as jpg with measurement results.
Measurement Accuracy (XY)	5μ at 30x 1μ at 200x
3D inspection mode	3D 360° manual rotation with 35° oblique angle viewing and 0° straight down view
Zoom Lens	30x-200x zoom with detents Expandable with optional lens adapters: 0.3x, 0.5x, 0.7x, 1.5x, 2x.
Field of View	1.2mm (at 200x) to 8mm (at 30x)
Viewing angle	0° straight view and 30° angle view with standard system
Working Distance	100mm (4″) WD with a straight view
	50mm (2″) WD with 30° angle view adapter
System Stand	Multi-position arm boom stand with focus control block and weight base
Power Supply	120-240V AC 50/60Hz
Computer Requirements	Windows 10/8/7 with USB2.0 port
Warranty	One Year Warranty
Options
LCD-12	12″ UltraSharp Retina Display 1920x1080p real-time 60 FPS viewing, HDMI Input Mounted on HD-60 camera for direct line of sight ergonomic inspection
LCD-24	24” Desktop 1920x1080p real-time 60 FPS viewing, HDMI Input
BGA-HM	BGA inspection mirror to work with SPI-200 for inspecting BGA solder joints
XY1711	17″ x 11″ XY sliding stage for Multi-position boom stand