Showing the single result
-
$8,900.00
Low-Cost, User-Friendly, Fast 3D SPI System
- Low-Cost, Off-Line, 3D SPI system supports multiple SMT lines for inspecting solder paste printing
- Improve your product yield and meet your customer’s requirements with an affordable budget
- Same measuring technique as high-end automated in-line SPI system
- Measure solder paste height with a laser beam
- User Friendly, Fast, Simple Mouse Clicks
- 3D real-time view of solder paste
- Zoom 15x – 200x
- Can Also Measure Typical Dimensions like Linear, XY, Radius, Diameter, Angle, Area, etc.
- Multiple Applications: BGA, SMT, Solder Inspection and Measurement
